Cracking in semiconductor devices–effect of plasticity under triaxial constraint
Publication information:
502, Sammy Hassan, Jyun-Lin Wu, Jason Lan, Sherwin Tang, Jun He, Joost J. Vlassak, and Zhigang Suo. 2024. “Cracking in Semiconductor Devices–effect of Plasticity under Triaxial Constraint”. Journal of the Mechanics and Physics of Solids, 193