A finite element analysis of the motion and evolution of void due to strain and electromigration induced surface diffusion
Publication information:
72, L. Xia, A.F. Bower, Z. Suo, and C. F. Shih. 1997. “A Finite Element Analysis of the Motion and Evolution of Void Due to Strain and Electromigration Induced Surface Diffusion”. Journal of the Mechanics and Physics of Solids, 45, Pp. 1473-93